Idézet:An expert integration of digital twin technology and advanced simulation methods for the design and optimization of electronic packaging systems
In Stochastic Finite Element Modeling in Electronic Packaging, distinguished researcher Liu Chu delivers an expert discussion of the latest advanced numerical methods and modeling techniques specific to electronic packaging. The book supplements its explanations with original MATLAB and ANSYS (APDL) code that can be applied immediately. It also includes robust examples that draw on a comprehensive description of the mechanics of electronic packaging modeling.
Chu explains the fundamentals of modeling logic and concepts in an accessible way that is ideal for beginners to the topic. She demonstrates practical guides and benchmarks that will assist readers in the testing, measurement, and modeling of their own materials.
Readers will also find:
✔A thorough introduction to a modeling approach that focuses on...

Idézet:? StochasticFiniteElementModelinginElectronicPackaging LiuChu.epub (Liu Chu) (2026) (43.15 MB)

Idézet:A kódrészlet megtekintéséhez be kell jelentkezned, vagy nincs jogosultságod a tartalom megtekintéséhez.

Idézet:A kódrészlet megtekintéséhez be kell jelentkezned, vagy nincs jogosultságod a tartalom megtekintéséhez.