Assembly and Reliability of Lead-Free Solder Joints (Repost)

[book24h]

Free Download Assembly and Reliability of Lead-Free Solder Joints by John H. Lau
English | EPUB | 2020 | 545 Pages | ISBN : 9811539197 | 237 MB
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints.

Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
[/b]

Buy Premium From My Links To Get Resumable Support,Max Speed & Support Me

A kódrészlet megtekintéséhez be kell jelentkezned, vagy nincs jogosultságod a tartalom megtekintéséhez.

Links are Interchangeable - Single Extraction